High performance thermal management materials
Various new advanced composite materials are now available, which provide great advantages over conventional materials for electronic packaging thermal control, including: Extremely high thermal...
View ArticleParameters affecting package thermal performance a low end system level example
Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly...
View ArticleNew Catalog Released
Fujipoly announces an Aug. 16 release date for its new Thermal Interface Material and Elastomeric Connector product catalog. The free 52-page product overview and technical design guide includes...
View ArticleThermoelectric Module Series Inspired by Temperatures on Neptune’s Moon
Marlow Industries’ new Triton ICE thermoelectric module series is inspired by sub-zero temperatures on Neptune’s moon Triton; the coolers can improve customer electronic systems in thermal performance,...
View ArticleHeat Sinks Designed for Higher Power Densities
The new R2 Series of heat sinks from Ohmite combines thermal performance with the attachment mechanism of the popular C Series. This heat sink is capable of attaching either a TO-220 or a TO-247...
View Article600-W DC-DC Converter with Integrated Heat Sink
CUI Inc is adding a 600 W device to the company’s line of rugged chassis mount DC-DC converters. The VFK600 series measures 7.8 x 5.0 x 1.5 inch and includes an integrated heat sink for improved...
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